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Now downloading free:Diamond 3002

Diamond 3002 free download

Audio equipment,digital audio, home audio, professional audio systems service manuals and repair information

File information:
File name:Diamond-3002 pwramp.pdf
[preview 3002]
Size:77 kB
Extension:pdf
Mfg:Diamond
Model:3002 🔎
Original:
Descr:power amplifier
Group:Electronics > Consumer electronics > Audio
Uploaded:25-12-2009
User:AndyMn
Multipart:No multipart

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Extracted files:1
File name Diamond-3002 pwramp.pdf

1 2 3 4 D5 AMPLIFIER PARTS SPECS. ALL ¼ Watt Resistors 2% metal film ALL 1 Watt Resistors 5% metal oxide 5 6 A 0.1 OHM 2 WATT Resistors shall be wire wound All other 2 Watt Resistors are metal oxide ALL CAPICATORS above 470 uF shall be LOW E.S.R. 105 degrees. 3300 uF Caps. Are snap in type POLY CAPS are dipped mylar 100 volt A D5300.2 AMPLIFIER SYSTEM INTERCONNECTION 2SC5200 AND 2SA1493 are TOSHIBA TL494 is TEXAS INSTRUMENTS DG405 is SILICONIX L1 and T1 as per DIAMOND AUDIO drawing D53002 Supply D53002 Supply RevC.SCH MUTE D53002 Preamp D53002 Preamp RevC.SCH MUTE CH1PWRIN CH2PWRIN D53002 Amp D53002 Amp RevC.SCH CH1PWRIN CH2PWRIN CH1OUT+ CH1OUTCH2OUT+ CH2OUT- POWER and SPEAKER pins as per drawing NOTES: 1. Power Ground and Signal Ground MUST are SINGLE POINT GROUNDED at the STORAGE CAPACITORS. 2. PCB copper thickness shall be a minimum of 2 Ounce/in**2. 3. Minmum Pad/Via size is 0.050" Diameter. 4. Minimum hole size is 0.025" Diameter. 5. Minimum Signal Trace width is 0.015". 6. Minimum Power Trace width is 0.250" (for Output and +/- Rails) 7. Mounting pads for 0.100" center through hole components, 1/4W Resistors, and small Capacitors shall be a Minimum of 0.075"X0.075" (prefered pad is 0.075" X 0.100" OVAL or larger id space permits). 8. All PCBs and Schematics to be in PROTEL format ONLY. (www.protel.com) 9. Heat sink all TO-220 or larger ICs unless mounting is called out as FREE AIR. 10. PCB and Schematic Libraries are to be supplied as part of the deliverables. 11. Sikscreen shall be WHITE non-conductive with a minimum Text size of 0.040" Height. CONTACTS: B B OC TAIL OC TAIL C UPDATES: 1. COMPONENTS ADDED: C97 - C104 2. VALUE CHANGES: R120, R122, C8, C13 3. IINCORPORATEDECO: Change R89 from 12K to 8.2K Change R126 , R127, from 150 ohms to 100 ohms Mark Busier (480) 813-6200 [email protected] J Schwitalla (310) 582-1121 X17 (310) 600-3841 Mobile [email protected] C D TITLE D D5300.2 AMPLIFIER MAIN BOARD ASSY. THIS DRAWING CONTAINS INFORMATION PROPRIETARY TO DIAMOND AUDIO TECHNOLOGY, INC. ANY REPRODUCTION, DISCLOSURE, OR USE OF THIS DRAWING IS EXPRESSLY PROHIBITED EXCEPT UPON EXPLICIT WRITTEN PERMISSION BY DIAMOND AUDIO TECHNOLOGY, INC. 1 2 3 Cannot open file F:\EDA\Projects\D5\D56002\DATTIT LE.wmf SIZE NEXT ASSY USEDON APPLICATION 4 B DRAWING NO. 400-6716 11:47:31AM 5 REV DRAWN SHEET C Schwitalla 1 of 4 DATE FILE 8/21/2003 C:\DON\D5\3002\REVC\D53002 Project RevC.sch 3030PennsylvaniaAve. Santa Monica, CA 90404 USA 6 1 2 3 4 5 6 R53 B+ F1 F2 30A R1 1.00K 10uF/25V 1.00K R2 C1 1.00K P1 A CON3SIP 30A 1 2 3 B+ REMOTE CGND R4 Q18 MPSA56 R33 270 / 1/4W SWB+ 10uF/25V R34 270 / 1/4W Q30 TIP41C VERT MNT FREE AIR R35 100 R5 1.00K R3 U1 4N36 R54 100K 100K D1 1N4750A R6 1.00K D2 MUR-160 D3 MUR-160 C96 0.047uF Poly SEC2 100 / 1W R66 R84 22 / 1W D4 MUR-160 D5 100uF/63V 10uF/50V C23 MUR-160 C17 U4 7805T N I GND R36 100 OUT +RAIL 100uF/63V C19 SEC1 SEC3 1 2 3 +AUX A 1.00K Q1 MPSA06 C2 C97 100u

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